2019-05-15 Origins of Silicon Valley - Paul Wesling
Note location change:
UIC Engineering Research Facility, Room 1043
842 W Taylor St
Chicago, IL 60607
Admission: Make your reservation on IEEE website, but otherwise: Free, General Admission, open to the public
Why did Silicon Valley come into being? The story goes back to local Hams (amateur radio operators) trying to break RCA's tube patents, “angel” investors, the sinking of the Titanic, Fred Terman and Stanford University, local invention of high-power tubes, WW II and radar, William Shockley's mother living in Palo Alto, and the SF Bay Area infrastructure that developed -- these factors pretty much determined that the semiconductor and IC industries would be located in the Santa Clara Valley, and that the Valley would remain the world’s innovation center as new technologies emerged -- computers, then software, mobile, biotech, Big Data, VR, and now autonomous vehicles -- and it would become the model for innovation worldwide.
Paul Wesling, an IEEE Life Fellow and Distinguished Lecturer, has observed the Valley for decades as an engineer, executive, resident, and educator, and has presented this talk world-wide. He gives an exciting and colorful history of device technology development and innovation that began in Palo Alto, then spread across the Santa Clara Valley during and following World War II. You'll meet some of the colorful characters – Leonard Fuller, Lee De Forest, Bill Eitel, Charles Litton, Fred Terman, David Packard, Bill Hewlett, Russ Varian and others -- who came to define the worldwide electronics industries through their inventions and process development. You’ll understand some of the novel management approaches that have become the hallmarks of tech startups and high-tech firms, and the kinds of engineers/developers who thrive in this work environment. He’ll end by telling us about some current local organizations that keep alive the spirit of the Hams, the Homebrew Computer Club, and the other entrepreneurial groups where geeks gather to invent the future. As vice president of publications for the IEEE Electronics Packaging Society for 22 years, Paul supervised four archival journals and a newsletter. He received the IEEE’s Centennial Medal, the Board's Distinguished Service award, the Society Contribution Award, and the IEEE's Third Millennium Medal.
IRPA is sponsoring our June ACM Meeting. Check out their Chicago event on 6/13/2019:
Proposed Future
Meeting Dates:
6/12/2019
ACM meeting
Topic: Automation
Sponsor: IRPA
6/13/2019
Digital OAISS Chicago
Chicago Chapter ACM is co-marketing this upcoming Chicago event. More information in the main window:
<----
The Digital OAISS Chicago event, produced by the Institute for Robotic Process Automation & AI, will focus on the countdown to 2020 - the tipping point for convergence of digital, automation and AI. This event, taking place on June 13th at Baker McKenzie in Chicago, will provide you with total accessibility to industry successes and lessons learned through close interaction with our team of experts and industry speakers. Buyers can register at no cost. Providers and influencers can register for as low as $225 with promo code: ACM10. To learn more and register, click here: http://bit.ly/2D56E2b
Subscribe to the Chicago Chapter ACM e-mail list. (Look for an e-mail after pressing the button)